Assembly of SMT and THT electronic devices

  • standard, aluminium, Teflon (PTFE), ceramic, CEM-1, CEM-3 circuits
  • various surface coatings​
  • rigid or flexible, multilayer
  • storage, washing, protection, varnishing​
  • in-line screen printers​​
  • step stencils​
  • nickel stencils (2x higher strength)​
  • steel stencils​
  • universal and glued frames​
  • housings from 01005​
  • Pin-in-Paste technology​
  • BGA/CSP, uBGA, QFP, uQFN​ stacking​
  • soldering in nitrogen atmosphere​
  • fitting verification​
  • trays, tapes and tubes handled​
  • Traceability​​
  • reflow ovens up to 20 zones​
  • measurement with profilometers​​
  • AOI 3D and 2D ​​
  • X-RAY​
  • optical inspection
  • New product implementation and batch control process​
  • independent stations with programmers​
  • cooperation of programmers with multiple manufacturers​
  • automatic cutting and bending
  • manual assembly and soldering​
  • soldering in nitrogen atmosphere
  • lead-free process
  • high fusion control capability  
  • waveform profiling with a profilometer
  • soldering temperature control
  • optical inspection
  • traceability of components used in the process
  • software update
  • BGA component exchange station
  • treatment of BGA components for assembly​
  • protective coating – varnishing in an ecological UV process ​
  • pouring of modules​​
  • automatic cleaning process for modules and stencils​
  • construction of testers and tests, including ICT and FCT ​