Assembly of SMT and THT electronic devices

  • Standard, aluminium, Teflon (PTFE), ceramic, CEM-1, CEM-3 circuits
  • Various surface coatings
  • Rigid or flexible, multilayer
  • Storage, washing, protection, varnishing
  • 100% product inspection at the output
  • Product testing from the perspective of end user
  • Each defect treated as an external complaint
  • 8D approach to a problem
  • housings from 01005​
  • Pin-in-Paste technology​
  • BGA/CSP, uBGA, QFP, uQFN​ stacking​
  • ISO 9001
  • ISO 14001
  • ISO 13485
  • Temperature and relative humidity measurements
  • Electrostatic field monitoring
  • Charge neutralisation measurements
  • Resistance measurements
  • Internal ESD training for employees
  • Control plans
  • 8D – a thorough method of team-based problem solving
  • PDCA – Deming cycle
  • Ishikawa, Pareto methods
  • Quality management system
  • Continuous system improvement
  • automatic cutting and bending
  • manual assembly and soldering​
  • soldering in nitrogen atmosphere
  • lead-free process
  • high fusion control capability
  • waveform profiling with a profilometer
  • soldering temperature control
  • optical inspection
  • traceability of components used in the process
  • software update
  • BGA component exchange station
  • treatment of BGA components for assembly​
  • protective coating – varnishing in an ecological UV process ​
  • pouring of modules​​
  • automatic cleaning process for modules and stencils​
  • construction of testers and tests, including ICT and FCT ​